61082-203409LF

Amphenol FCI
649-61082-203409LF
61082-203409LF

Mfr.:

Description:
Board to Board & Mezzanine Connectors 0.8MM B TO B REC

ECAD Model:
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In Stock: 280

Stock:
280 Can Dispatch Immediately
Factory Lead Time:
6 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
8,16 € 8,16 €
7,34 € 73,40 €
6,92 € 173,00 €
6,74 € 337,00 €
6,56 € 656,00 €
5,86 € 1 465,00 €
5,50 € 2 750,00 €
5,12 € 5 120,00 €

Product Attribute Attribute Value Select Attribute
Amphenol
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Receptacles
200 Position
0.8 mm (0.031 in)
800 mA
100 V
- 40 C
+ 125 C
Gold
Nickel Copper
Liquid Crystal Polymer (LCP)
BergStak 0.80mm
Tube
Brand: Amphenol FCI
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 5
Subcategory: Board to Board & Mezzanine Connectors
Tradename: Bergstak
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TARIC:
8536693000
CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

BergStak® 0.8mm Connectors

Amphenol FCI compact Bergstak® 0.8mm pitch connector series offers an extensive range of stack heights and circuit sizes to support a wide range of mezzanine, board-stacking communications, data, and industrial applications. Amphenol FCI BergStak connectors are available in sizes from 40 to 200 positions in 20-position increments and stack heights from 5mm to 16mm in 1mm increments.

Bergstak® Board-to-Board Connectors

Amphenol FCI Bergstak® Board-to-Board Connectors are designed for industrial, telecom, datacom, automotive, and medical applications. These Bergstak connectors from Amphenol FCI offer micro-pitches from 0.40mm to 0.80mm, connector position options from 10 to 200, and stack height flexibility from 3mm to 20mm. The wide-ranging product line is suited to fit a variety of application requirements.