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M80-7016322

Name: Harwin M80-7016322
Brand: Harwin
SKU: 855-M80-7016322
Price: 21.4 EUR
Availability: OutOfStock

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Mouser No:

855-M80-7016322

Mfr. No:

M80-7016322

Mfr.:

Harwin

Description:

Power to the Board Datamate M80 63 WAY MALE 90 DEG CONN

Datasheet:

M80-7016322 Datasheet (PDF)

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Learn more about Harwin M80-7016322

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Stock:: 0

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Factory Lead Time:: 8 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	21,40 €	21,40 €
	18,18 €	181,80 €
	17,05 €	341,00 €
	16,23 €	811,50 €
	15,69 €	1 569,00 €
	14,82 €	2 964,00 €
	14,39 €	7 195,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Harwin
Product Category:	Power to the Board
RoHS:	N
Product Type:	Power to the Board
Current Rating:	3 A
Number of Positions:	63 Position
Mounting Style:	Mounting Peg
Termination Style:	Solder
Pitch:	2 mm
Series:	M80
Tradename:	Datamate
Brand:	Harwin
Contact Material:	Phosphor Bronze
Contact Plating:	Gold
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	GB
Housing Material:	Polyamide (PA)
Insulation Resistance:	100 MOhms
Maximum Operating Temperature:	+ 125 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Right Angle
Number of Rows:	3 Row
Product:	Headers
Factory Pack Quantity:	10
Subcategory:	Power Connectors

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Datasheet

M80-7016322 Datasheet (PDF)

Technical Resources

Component Specification (PDF)

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

Datamate J-Tek Connectors for High Reliability

Harwin Datamate J-Tek Connectors for High Reliability are secure and robust 2mm-pitch connectors that offer high performance in demanding applications. The J-Tek design provides a low-profile solution for all variations of cable-to-board, board-to-board, and cable-to-cable interconnect requirements. The series features a variety of stainless-steel jackscrew hardware options for increased security and strain relief. The field-proven 4-finger beryllium copper and gold-plated contact achieve 3A electrically loaded under extremes of shock (100G), vibration (20G), and temperature (-55°C to +125°C). Lightweight metal backshells are available for full 360° shielding against RFI and EMI interference. With their compact size and highly reliable performance, Harwin J-Tek connectors are suitable for mission and safety-critical applications in industrial, aerospace, space, military, and medical applications.

Datamate Connectors

Harwin Datamate Connectors consist of high-reliability/high-performance 2mm pitch connectors designed to withstand vibration, shock, and temperature extremes in harsh environments. Featuring Harwin's high-reliability four-finger beryllium copper contact technology, these Datamate connectors ensure the integrity of connections without loss of data even under the most severe conditions. The Datamate Connectors offer 100G shock, 40G bump, 10G vibration resistance, and are able to operate under temperatures as extreme as -55°C to 125°C. Typical applications include defense and security, motorsport, aviation, and new space.

Datamate Mix-Tek Mixed-Technology Connectors

Harwin Datamate Mix-Tek Connectors include 2mm pitch (signal) and 4mm pitch (power/coaxial) high-reliability, high-performance connectors designed to perform under extreme conditions. Male and female cable connector housings can be specified in combination with signal contacts or with 4mm pitch only for a true mixed technology connector. Housings are compatible with these contact options: Signal (3.3A), Standard Power (20A), High Power (40A), and Coax (50Ω). The Mix-Tek series includes the most popular cable housings sizes, compatible with each other for cable-to-cable or with PCB connectors for cable-to-board combinations. To meet the demanding requirements of vibration, shock, and strain relief, jackscrews provide added security in various styles for added flexibility. Applications for Harwin Datamate Mix-Tek Connectors include aerospace, autosport, military, robotics, and industrial.