ST60A3H1C1CCEPY3

STMicroelectronics
511-ST60A3H1C1CCEPY3
ST60A3H1C1CCEPY3

Mfr.:

Description:
RF Transceiver 60 GHz V-band contactless connectivity transceiver linear polarization int ant

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

Availability

Stock:
0

You can still purchase this product for backorder.

Factory Lead Time:
24 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
7,78 € 7,78 €
6,76 € 67,60 €
6,40 € 160,00 €
5,91 € 591,00 €
5,56 € 1 390,00 €
5,24 € 2 620,00 €
5,10 € 5 100,00 €
5 880 Quote

Product Attribute Attribute Value Select Attribute
STMicroelectronics
Product Category: RF Transceiver
RoHS:  
Tray
Brand: STMicroelectronics
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: FR
Moisture Sensitive: Yes
Product Type: RF Transceiver
Series: ST60A3H1
Factory Pack Quantity: 2940
Subcategory: Wireless & RF Integrated Circuits
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

This functionality requires JavaScript to be enabled.

USHTS:
8542390090
MXHTS:
8542399999
ECCN:
5A991.b.6.b

ST60A3H1 V-Band Connectivity Transceivers

STMicroelectronics ST60A3H1 V-Band Connectivity Transceiver is an RF millimeter-wave transceiver product with a dual-linear polarization integrated antenna, operating in the 60GHz V-band from 60GHz to 61GHz. The ST60A3H1 has a miniature form factor, low-power operation, and an optimized bill of materials (BOM). The ST60A3H1 is a high-speed RF transceiver compliant with eUSB2, UART, and I2C protocols. The transceiver module contains general-purpose input/output (GPIO) that are also available in tunneling mode. The STMicroelectronics ST60A3H1 meets the requirements of various applications due to the device's compactness, low-power operation, ease of use, and innovative architecture design, which optimizes the system bill of materials.