GPHC5.0-0.060-02-0816

Bergquist Company
951-GPHC5.0-6002-816
GPHC5.0-0.060-02-0816

Mfr.:

Description:
Thermal Interface Products GAP PAD, S-Class, 8"x16" Sheet, 0.060" Thickness, TGPHC5000/HC 5.0, IDH 2195378

Datasheet:
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Learn more about Bergquist Company GPHC5.0-0.060-02-0816

Availability

Stock:
0

You can still purchase this product for backorder.

Factory Lead Time:
5 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
85,54 € 85,54 €
76,95 € 769,50 €
76,87 € 1 921,75 €
74,68 € 3 734,00 €
74,16 € 7 416,00 €
500 Quote

Product Attribute Attribute Value Select Attribute
Bergquist Company
Product Category: Thermal Interface Products
RoHS:  
Gap Fillers / Gap Pads / Sheets
Thermal Pad
Non-standard
Silicone
5 W/m-K
5 kVAC
Gray
- 60 C
+ 200 C
406.4 mm
203.2 mm
1.524 mm
17.5 psi
UL 94 V-0
HC 5.0 / TGP HC5000
Brand: Bergquist Company
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Designed for: Telecommunications, ASICs/DSPs, Consumer Electronics, Thermal Modules or Heat Sinks
Product Type: Thermal Interface Products
Size: 8 in x 16 in
Factory Pack Quantity: 1
Subcategory: Thermal Management
Tradename: GAP PAD
Part # Aliases: L8INW16INH0.06 PN0008397 2195378
Unit Weight: 439 g
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Attributes selected: 0

TARIC:
8541900000
CNHTS:
8541900000
CAHTS:
8541900000
USHTS:
3919905060
JPHTS:
8542900006
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99

GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.

Green Energy

Bergquist Company Green Energy products are designed to improve alternative energy conversion and storage, boosting the efficiency of solar power networks. Harnessing power from the sun and other energy sources advances sustainability efforts while increasing the amount and availability of global power, even in places that have limited infrastructure. This green energy product lineup from Bergquist features robust products ideal for solar power inverters, solar power optimizers, industrial battery chargers, and lithium-ion batteries.

Data Centre Applications

Bergquist Company Data Center Applications feature advanced materials that help with thermal management, long-term reliability, and stress protection. Data center speeds and volumes are growing as analytics, artificial intelligence (AI), and high-performance computing go mainstream. This increased demand is causing next-generation data centers to run hotter, and this heat can degrade performance. Bergquist Company designs and manufactures component-level thermal management and stress protection products, which help meet these heightened performance requirements.

Router Switch & Network Applications

Bergquist Company Router Switch and Network Applications include phase change materials and thermally conductive adhesives designed to dissipate heat away from thermally sensitive components. The utilization of advanced materials in server motherboards and line cards for routers and switches offers benefits such as scale and cost reduction. One small uptick in performance, repeated thousands of times, provides a notable impact on router and switch performance. Thermal products from Bergquist Company help components function properly for optimal operation.

Storage Applications

Bergquist Company Storage Applications feature advanced materials used in storage hardware to provide increased reliability, greater stability, and improved transfer rates. Every uptick in reliability and performance lowers costs while meeting increased user expectations. The thermal management materials from Bergquist Company include a broad variety of product types to meet various application needs.

Server Applications

Bergquist Company Server Applications feature thermal management products designed for a wide range of use — from a few servers in a closet to thousands of them in a data center. No matter the number of servers, a slight reduction in heat or improvement in component performance can significantly impact infrastructure operation. Bergquist Company offers advanced materials for use throughout a circuit board, helping to optimize performance and the corresponding network.

Industrial Automation

Bergquist Industrial Automation provides advanced materials that are crucial in groundbreaking industrial automation technologies and the advancement of Industry 4.0. Industrial processes are changing, and artificial intelligence (AI), machine learning, robotics, and the Industrial Internet of Things (IIoT) are moving mainstream. These developments make it critical to have the right material and components to dissipate heat, protect electronics in harsh environments, secure components, and deliver electrical integrity.

5G Products

Bergquist 5G Products are designed to meet the demanding conditions required for 5G telecom infrastructure components. These highly stable interconnect materials provide fundamental electrical functions for dependable telecom infrastructure performance, ensuring reliable, long-term performance. The Bergquist 5G portfolio features multiple formats, including pads, gels, liquids, and adhesives, to maximize system reliability.

TGP HC5000 Highly Conformable GAP PAD®

Bergquist Company TGP HC5000 Highly Conformable GAP PAD® is a silicon-based 5.0 W/m-K high compliance GAP PAD that is non-electrically conductive and highly conformable. The HC5.0 GAP PAD is available in various thicknesses and custom part sizes and features low hardness and modules. The thermal interface is tacky on one side with a clear PET liner with reduced tack on one side and Blue Diamond liner. Bergquist Company TGP HC5000 Highly Conformable GAP PAD is easily reworkable.

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