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APAKN1304-S5517-T

Name: ABRACON APAKN1304-S5517-T
Brand: ABRACON
SKU: 815-APAKN1304-S5517T
Price: 3.19 EUR
Availability: InStock

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Mouser No:

815-APAKN1304-S5517T

Mfr. No:

APAKN1304-S5517-T

Mfr.:

ABRACON

Description:

Antennas Internal/Embedded Antennas Passive Patch Surface Mount Solder

Datasheet:

APAKN1304-S5517-T Datasheet (PDF)

ECAD Model:

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Learn more about ABRACON APAKN1304-S5517-T

In Stock: 1 561

Stock:: 1 561 Can Dispatch Immediately

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Factory Lead Time:: 14 Weeks Estimated factory production time for quantities greater than shown.

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Ext. Price:

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	3,19 €	3,19 €
	2,08 €	20,80 €
	1,96 €	49,00 €
	1,67 €	167,00 €
	1,57 €	392,50 €
	1,37 €	685,00 €
	1,16 €	1 160,00 €
	1,01 €	2 525,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	ABRACON
Product Category:	Antennas
RoHS:
Product Type:	2.4GHz Antenna - 2.4GHz, 5GHz, Bluetooth, WiFi, WLAN, Zigbee
Product:	PCB Antennas
Type:	Passive Antenna
Minimum Frequency:	5.15 GHz
Maximum Frequency:	5.885 GHz
Protocol - WiFi - 802.11:	WiFi
Protocol - Sub GHz:	ISM
Mechanical Style:	Patch
Style:	Ceramic
Gain:	6 dBi
Bandwidth:	500 MHz
Impedance:	50 Ohms
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Number of Bands:	1 Band
Mounting Style:	PCB Mount
Termination Style:	SMD/SMT
Centre Frequency:	5.5175 GHz
Application:	ISM Applications
Length:	13 mm
Width:	13 mm
Height:	4 mm
Series:	APAK
Packaging:	Tray
Brand:	ABRACON
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Polarisation:	Linear
Factory Pack Quantity:	500
Subcategory:	Antennas

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Datasheet

APAKN1304-S5517-T Datasheet (PDF)

CNHTS:: 8529101000
USHTS:: 8517710000
ECCN:: EAR99

Ceramic Patch Antennas

Abracon Patch Antennas are linear and Right Hand Circular Polarization (RHCP) ceramic-type antennas that offer multi-band frequency operations with high gain. The ceramic patch antennas offer 50Ω impedance and a surface mounting termination style. These patch antennas are available in a low-profile, small form factor package. Applications include remote IoT, ISM applications, wireless communication, and more.