CL02C270JA2NNNC

Samsung Electro-Mechanics
187-CL02C270JA2NNNC
CL02C270JA2NNNC

Mfr.:

Description:
Multilayer Ceramic Capacitors MLCC - SMD/SMT 27pF C0G 25V 01005

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
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More Information
Learn more about Samsung Electro-Mechanics CL02C270JA2NNNC

In Stock: 60 000

Stock:
60 000
Can Dispatch Immediately
On Order:
60 000
Factory Lead Time:
57
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 20000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
0,172 € 0,17 €
0,026 € 0,26 €
0,015 € 1,50 €
0,011 € 5,50 €
0,009 € 9,00 €
0,008 € 20,00 €
0,007 € 35,00 €
0,006 € 60,00 €
Full Reel (Order in multiples of 20000)
0,004 € 80,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Samsung Electro-Mechanics
Product Category: Multilayer Ceramic Capacitors MLCC - SMD/SMT
RoHS:  
27 pF
25 VDC
C0G (NP0)
5 %
01005
0402
SMD/SMT
- 55 C
+ 150 C
0.4 mm (0.016 in)
0.2 mm (0.008 in)
0.22 mm (0.009 in)
General Type MLCCs
CL
Reel
Cut Tape
MouseReel
Brand: Samsung Electro-Mechanics
Class: Class 1
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: PH
Package/Case: 01005 (0402 metric)
Product Type: Ceramic Capacitors
Factory Pack Quantity: 20000
Subcategory: Capacitors
Type: MLCC
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Attributes selected: 0

Datasheet

TARIC:
8532240000
CNHTS:
8532241000
USHTS:
8532240020
JPHTS:
853224000
BRHTS:
85322410
ECCN:
EAR99

CL MLCC Standard Normal Capacitors

Samsung Electro-Mechanics CL MLCC Standard Normal Capacitors are broadly available chip-type capacitor that temporarily charges and remove noise in electric circuits. These standard normal capacitors offer various sizes and a wide range of capacities. The CL Multilayer Ceramic Capacitors (MLCC) provide a structural capacity to mount chips on a PCB at high speed. Typical applications include automotive, smartphones, PC, HDD/SSD boards, tablets, displays, game machines, and DC-DC converters.

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