All Results (1 250)

Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS

Bergquist Company Thermal Interface Products Insulator, 0.006" Thickness, 1 Side Adhesive, SIL PAD TSPK1300/K-10, K10AC-110 Drop Dispatch Lead Time 6 Weeks
Min.: 1 500
Mult.: 1 500

Bergquist Company Thermal Interface Products Gap Filler, 2-Part, 2.9 W/m-K, Silicone, 400CC Cartridge, IDH 2859942 Drop Dispatch Lead Time 11 Weeks
Min.: 1
Mult.: 1

Bergquist Company Thermal Interface Products 1-Part, Cure Gel Material, 12oz/343CC, 3.5W/m-K, Liqui-Form TLF3500CGEL/3500CGEL Drop Dispatch Lead Time 5 Weeks
Min.: 6
Mult.: 1
Bergquist Company Thermal Interface Products Gap Filler, Thermally Conductive, Sil-Free, 400CC Kit, TGF1100SF/1100SF Drop Dispatch Lead Time 5 Weeks
Min.: 5
Mult.: 1

Bergquist Company Thermal Interface Products GAP PAD, 8"x16" Sheet, 0.080" Thickness, 1 Side Adhesive, TGP800VO/VO Drop Dispatch Lead Time 5 Weeks
Min.: 1
Mult.: 1


Bergquist Company Thermal Interface Products Sil-Pad, 0.009" Thickness, 1 Side Adhesive, Sil-Pad TSP900/400 Drop Dispatch Lead Time 8 Weeks
Min.: 2 765
Mult.: 1

Bergquist Company Thermal Interface Products GAP PAD, 10W/m-K, 8" x 8" Sheet, 0.100" Thickness, TGP10000ULM, IDH 2599712 Drop Dispatch Lead Time 6 Weeks
Min.: 2
Mult.: 1

Bergquist Company Thermal Interface Products GAP PAD, Sil-Free, 9"x18" Sheet, 0.023" Thickness, 1 Side Tack, TGP3004SF/3004SF Drop Dispatch Lead Time 4 Weeks
Min.: 2
Mult.: 1

Bergquist Company 2680904
Bergquist Company Thermal Interface Products Conductive, 1-Part, Cure Gel Sil-Free Material, 4.5 W/m-K, Liqui-Form Drop Dispatch Lead Time 4 Weeks
Min.: 3
Mult.: 1

Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, 6 Gallon Kit, IDH 2166671 Drop Dispatch Lead Time 3 Weeks
Min.: 1
Mult.: 1

Bergquist Company Thermal Interface Products The Original Sil-Pad Material, Sil-Pad TSP 900 Series / Also Known as Bergquist Sil-Pad 400 Series Drop Dispatch Lead Time 6 Weeks
Min.: 30
Mult.: 1
Bergquist Company Thermal Interface Products Economical, High Performance Insulator, Sil-Pad TSP 1500/Sil-Pad 1500 Drop Dispatch Lead Time 12 Weeks
Min.: 1
Mult.: 1
Bergquist Company Thermal Interface Products Conductive Material for Filling Air Gaps, GAP PAD TGP 1000VOUS/VO Ultra Soft Drop Dispatch Lead Time 4 Weeks
Min.: 10
Mult.: 1

Bergquist Company Thermal Interface Products Original Sil-Pad, 0.009" Thickness, Sil-Pad TSP 1200/Also Known as Sil-Pad 1000 Drop Dispatch Lead Time 8 Weeks
Min.: 1 826
Mult.: 1

Bergquist Company Thermal Interface Products Sil-Pad, 0.009" Thickness, 1 Side Adhesive, 0.75x0.5", Sil-Pad TSP900/400 Drop Dispatch Lead Time 7 Weeks
Min.: 5 300
Mult.: 1
Bergquist Company Thermal Interface Products Sil-Pad, 0.009" Thickness, 1 Side Adhesive, 0.86x0.74", Sil-Pad TSP900/400 Drop Dispatch Lead Time 9 Weeks
Min.: 1 848
Mult.: 1
Bergquist Company Thermal Interface Products The Original Sil-Pad Material, Sil-Pad TSP 900 / Also Known as Sil-Pad 400 Drop Dispatch Lead Time 7 Weeks
Min.: 9 300
Mult.: 1
Bergquist Company Thermal Interface Products 1-Part, Cure Gel Material, 600CC, 3.5W/m-K, Liqui-Form TLF3500CGEL/3500 CGEL Drop Dispatch Lead Time 4 Weeks
Min.: 3
Mult.: 1
Bergquist Company Thermal Interface Products 1-Part, Cure Gel Material, 6oz/150CC, 3.5W/m-K, Liqui-Form TLF3500CGEL/3500 CGEL Drop Dispatch Lead Time 5 Weeks
Min.: 8
Mult.: 1

Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.140" Thickness Drop Dispatch Lead Time 11 Weeks
Min.: 2
Mult.: 1

Bergquist Company Thermal Interface Products Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO/Gap Filler 3500LV Drop Dispatch Lead Time 4 Weeks
Min.: 1
Mult.: 1
Bergquist Company Thermal Interface Products Liquid Gap Filler, 20oz Tube, Gap Filler TGF 3500LVO/3500LV Drop Dispatch Lead Time 4 Weeks
Min.: 1
Mult.: 1

Bergquist Company Thermal Interface Products Thermally Conductive, One-Part, Liquid Formable Gel Material, 300CC, Liqui-Form TLF 6000HG Series Drop Dispatch Lead Time 4 Weeks
Min.: 10
Mult.: 1

Bergquist Company Thermal Interface Products Liquid Gap-Filling Material, 2-Part, 4.5W/m-K, 5 Gallon Hobbock/Pail, TGF4500CVO Drop Dispatch Lead Time 3 Weeks
Min.: 1
Mult.: 1

Bergquist Company Bergquist Company Gap Filler, Low Volatility, Silicone, 2-Part, Room Temp Cure, 2 x 5 Gallon Pails
Drop Dispatch Lead Time 3 Weeks
Min.: 1
Mult.: 1