All Results (1 058)

Computer-On-Modules - COM COM Express Type 6 Basic module with Skylake-H Intel Core i3-6102E quad core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface.

Computer-On-Modules - COM COM Express Type 7 Basic module based on Intel Atom C3308 2-core processor with 1.6 GHz, 4MB Cache and dual channel DDR4 2133 MT/s memory interface for up to 64 GByte (formerly Denverton). Features four 2.5GbE KX interface ports. Commercial tempera

Heat Sinks Heat spreader solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.

Computer Cables Cable for LVDS Panel with JST SHDR-40V connector, 50 cm, Open End, matches also with conga-JC370.

Heat Sinks HSP COMe-mRP10 Cu-core slim through

Computer-On-Modules - COM COM Express Type 6 Basic module with Skylake-H Intel Core i3-6100E quad core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface.

CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.

Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/mRLP. All standoffs are with 2.7mm bore hole.

CPU & Chip Coolers COMe Active Uni Cooler2 (w/o HSP)

Computer-On-Modules - COM COM Express COM.0 R3.1 basic pin-out type 7 withIntel D-1732TE 52W 8 core 1.9GHz

Heat Sinks * Standard Heat spreader for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole

Computer-On-Modules - COM JUMPtec HSP COMe-cWL6 Cu-core through