Samtec LPAM Series Board to Board & Mezzanine Connectors

Results: 74
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Number of Positions Pitch Number of Rows Termination Style Mounting Angle Stack Height Current Rating Voltage Rating Maximum Data Rate Minimum Operating Temperature Maximum Operating Temperature Contact Plating Contact Material Housing Material Series Packaging
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec Board to Board & Mezzanine Connectors 1.27MM LP ARRAY HS HD LOW PRO

LPAM Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape