Laird Technologies
Laird Technologies designs and develops electronic device protection solutions, including EMI suppression, thermal management materials, structural and precision metals, and multi-functional products. Materials science experts enable improved protection, higher performance and reliability, custom structural designs and faster time-to-market.
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Laird Technologies Tflex SF4 Thermal Gap FillersSilicon-free and offers a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity.10.9.2024 -
Laird Technologies Tflex SF7 Thermal Gap FillersInnovative, high-performing thermal material with silicone-free construction.10.9.2024 -
Laird Technologies BMI-S-608 Shield FrameOne-part shielding solution with a stainless-steel design and without a top-mount cover.10.6.2024 -
Laird Technologies ReZorb™ S MM Wave Elastomer AbsorbersPure dielectric silicone absorbers with no magnetic properties.9.1.2024 -
Laird Technologies Eccosorb™ RF-RET Broadband Foam AbsorbersLightweight open-celled reticulated foam absorbers that offer 20dB performance ratings.22.12.2023 -
Laird Technologies RobZorb® GDS Dispensable Elastomeric AbsorbersDesigned for optimum performance over an 18GHz to 35GHz frequency range.20.10.2023 -
Laird Technologies NA12065 Steward™ Nanocrystalline SheetsProvide high-permeability solution for EMI mitigation over a frequency range from 100KHz to 100MHz.11.10.2023 -
Laird Technologies CoolZorb 200 Hybrid TIM/EMI AbsorbersHybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.8.9.2023 -
Laird Technologies NoiseSorb NS1000HTRC Noise Suppression AbsorbersExcellent temperature stability, a 0.1mm thickness, and a 20MHz to 3GHz effective frequency range.4.5.2023 -
Laird Technologies Eccosorb™ RF-LW Microwave AbsorbersOffers high attenuation for cavity-resonance problems and surface-current attenuation.22.12.2022 -
Laird Technologies Eccosorb™ RF-LB EMI Noise Suppression AbsorbersSilicone-based elastomeric absorber with an improved low-frequency filler system.13.12.2022 -
Laird Technologies CMA0805 Automotive Common Mode ChokesCompact, low 1.20mm profile, ideal for automotive electronics, industrial, & telecom applications.27.10.2022 -
Laird Technologies Eccosorb JCS-NextDielectrically loaded silicone absorber, targeting high-frequency noise above 30GHz.24.10.2022 -
Laird Technologies MHAH High-Temperature Molded SMD Power InductorsImproves consumer electronics and telecom designs' performance, reliability, and efficiency.11.10.2022 -
Laird Technologies CPI0603 Multilayer Ferrite Chip Power InductorsRobust, small-sized structures that allow for higher mounting density.26.9.2022 -
Laird Technologies IWC SMD Wirewound Ceramic Chip InductorsFeature high resonance frequencies and narrow inductance tolerances (±2% or ±5%).26.9.2022 -
Laird Technologies Tpcm™ 7000 High-Performance TIMsDesigned to enhance the cooling of the thermal challenges in electronics.3.8.2022 -
Laird Technologies Tflex™ HD7.5 Thermal Gap FillerSoft silicone material that offers high deflection and 7.5W/mK thermal conductivity.3.8.2022 -
Laird Technologies Tpcm™ 5000 High-Performance TIMFeatures low thermal resistance and a non-silicone formulation with a naturally tacky surface.19.7.2022 -
Laird Technologies Ttape™ 1000A Thermally Conductive TapePressure-sensitive adhesive with low thermal resistance, only needs finger pressure for application.3.6.2022 -
Laird Technologies Fabric-Over-Foam (FoF) 51G EMI GasketsFeature >100dB shielding effectiveness across a wide spectrum of frequencies.10.5.2022 -
Laird Technologies Fabric-Over-Foam (FoF) 221 EMI GasketsProvide excellent EMI shielding performance for users where EMI issues occur.10.5.2022 -
Laird Technologies Tflex™ RB300 Thermal Gap FillerExceptionally soft gap filler pads with a thermal conductivity of 1.2 W/mK.30.3.2022